F2 Technology

 

Before Patented F2 Polish

Before F2 Polish
Before Patented F2 Polish

Before F2 Polish

Asahitec's patented F2 Polish - The difference between an Asahitec stencil and that of the competitor. Asahitec's patented F2 Polishing process was developed in-house primarily for the manufacture of stencils for the semiconductor industry. This technology has now been implemented for SMT stencils with great success.


After Patented F2 Polish

After F2 Polish
After Patented F2 Polish

After F2 Polish

 

It consists of two different polishes or 2 F's to be precise. The first F is the FLAT polishing technique that is done for the inside hole walls. This polish removes burrs and creates a smooth aperture wall which helps in paste release of fine pitch and small diameters BGA components. The second F is the FLASH polish which creates an even surface for printing. This mirror like finish produces a more consistent and flat surface of the stencil which enables the squeegee blade to travel efficiently and deposit the required amount of paste every stroke.

Printing without F2 Polish

Printing without F2 Polish
Printing with F2 Polish

Printing with F2 Polish

 

Tests have shown that stencils made using F2 Polishing technology is comparable to and in many cases better performing than nickle electroformed stencils. Surface roughness tests as shown below prove that Flash polish gives a more consistent surface. When combines with Nano Coating this polishing process will maximize yields and reduce process defects related to printing.

Surface Roughness Test Before F2 Polish

Surface Roughness Test Before F2 Polish
Surface Roughness Test After F2 Polish

Surface Roughness Test After F2 Polish